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27th Meeting

Tooling & Legal Subgroup 27th Meeting

    Schedule

    • Purpose: Tooling and Legal Subgroup 27th Meeting
    • Date: April 9, 2026 (THU) 14:00 ~ 18:00
    • Venue: OpenUp Center > Ground 4

    Attendees

    • Ahnlab
    • Doosan Coorporation Digital Innovation BU
    • ETRI
    • Hancom
    • Hyundai Autoever
    • Hyundai Mobis
    • Kakao
    • LG Electronics
    • LG AI Research
    • Samsung Electronics
    • Telechips
    • TMap Mobility

    Invitee

    • SM Solutions

    Agenda

    NoSubjectSpeakerSlide
    0Community Updates & New IssuesLG Electronics, Park Wonjaepdf
    1Discussion on OSS NoticeLG Electronics, Park WonjaeN/A
    2Introduction to SentiON SCASM Solutions, Kim Sangmopdf