27th Meeting

Tooling & Legal Subgroup 27th Meeting

Schedule

  • Purpose: Tooling and Legal Subgroup 27th Meeting
  • Date: April 9, 2026 (THU) 14:00 ~ 18:00
  • Venue: OpenUp Center > Ground 4

Attendees

  • Ahnlab
  • Doosan Coorporation Digital Innovation BU
  • ETRI
  • Hancom
  • Hyundai Autoever
  • Hyundai Mobis
  • Kakao
  • LG Electronics
  • LG AI Research
  • Samsung Electronics
  • Telechips
  • TMap Mobility

Invitee

  • SM Solutions

Agenda

NoSubjectSpeakerSlide
0Community Updates & New IssuesLG Electronics, Park Wonjaepdf
1Discussion on OSS NoticeLG Electronics, Park WonjaeN/A
2Introduction to SentiON SCASM Solutions, Kim Sangmopdf
Last modified April 11, 2026: Update T&L 27th and 28th (e7de7b8d1)